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Consistent Sharpness Dicing Saw Blade , Self - Sharpening Wafer Saw Blade

Categories Resin Bond Diamond Blades
Brand Name: Hongtuo
Model Number: HT-RB
Certification: ISO9001:2015&ISO16949
Place of Origin: Henan, China (Mainland)
MOQ: 2
Price: Price can be negotiated
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
Delivery Time: 2-3weeks
Packaging Details: Carton Box
Type: Machine Blade
Blade Material: Diamond
Size: 58
Application: Semicoductor,Ceramic chips
Thickness: 0.25MM
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    Consistent Sharpness Dicing Saw Blade , Self - Sharpening Wafer Saw Blade

    Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

    Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

    Features:

    1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

    2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

    Applications:

    This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

    Specifications


    Technical Parameters

    O.DThicknessI.D
    SizeToleranceSizeStandard toleranceHigh precision toleranceSizeTolerance
    50~ 100+0.020.1~≤ 0.15±0.00525.4
    30
    31.75
    40
    60
    80
    88.9
    +0.02~ 0

    Product Tags:

    precision diamond saw

      

    disco dicing saw

      
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