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Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

Categories Resin Bond Abrasives
Brand Name: CAEC
Model Number: 1A1, 14A1
Certification: ISO9001, ISO14001, OHSAS18001
Place of Origin: Henan, China
MOQ: One piece
Price: USD 1 for one piece
Supply Ability: 50000 pieces per month
Delivery Time: 7-10 days
Packaging Details: Standard package for export
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Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot


Diamond grinding wheel is used to process and trim the external circle of the sapphire ingot to obtain precise external circle dimensional accuracy and edge shape and the oriented-side plane(OF plane) of sapphire ingot by grinding the reference edge.


Main features

High sharpness---high processing efficiency for hard and brittle materials such as sapphire.

Good elasticity---have a polishing effect, good surface quality of the workpiece.

Stable quality---uniform consumption in use and long service life.


Specification :

Universally specification

Bond

Type

Specification

Resin bond


1A1

14A1

200D-20T-20H-5W

250D-25T-76H-5W

300D-20T-127/203H-5W

300D-40T-127/203H -5W

350D-40T-127/203H -5W

400D-40T-127/203H -5W

Metal bond


66D-8W-56L
Note: the wheel specification can be produced according to customer’s requirement.
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