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EMI Shielding Wire Mesh Copper Wool 99.9 For EMC Chamber

Categories RF Shielding Copper Foil
Model Number: H
Place of Origin: Jiangsu, China
Brand Name: HAOZHUO
Supply Ability: 100 Roll/Rolls per Week
Packaging Details: carton
MOQ: >=1 Rolls
Price: $300.00
Type: RC Filter
Transfer Function: Low Pass
Package Type: Surface Mount
Nominal Center Frequency: 50
3dB Bandwidth: 10M
Insertion Loss: 100dB
Input Impedance: 50
Stopband Attenuation: 3dB
application: mri rf room
color: copper
Wire diameter: 0.07mm
moq: 2.5Kg
Lead Time: 7-10 workdays
Port: shanghai
Certification: CE RoHS
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EMI Shielding Wire Mesh Copper Wool 99.9 For EMC Chamber

EMI Shielding Copper Wool 99.9% Copper For EMC Chamber


What are the types of shielding for EMI/RF?
The primary types of EMI shielding are shielding directly on a printed circuit board, or around the seams of an enclosure. Depending on the application, a board level shield, finger stock gasket or fabric over foam gasket would be preferable.


What are common applications of the different shielding types? Which shielding types are preferred for different applications?
Selecting the right type of EMI shielding solution begins with analyzing many factors such as the environment, RF frequencies of concern to the project and mechanical requirements.

When picking a board level shield, what are the benefits of Nickel Silver versus Tin-Plated Steel?
Tin-plated steel and nickel silver perform at a relatively similar rate, however the difference between the two is the frequency ranges that each performs better at. Tin plated steel is preferable if trying to block low frequency waves from creating interference, while nickel silver blocks mid to high frequency waves more effectively. Each will block EMI/RF across different ranges but specialize within their specific ranges.


Product description
Namecopper foil
Material99.8% copper
Widthstandard 1350mm
Thicknessstandard 0.105mm(3oz),0.14mm(4oz)
FeatureEMI shielding
Applicationfaraday cage,MRI room

Product description:

1. The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.

2. Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.

3. The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.


Part NumberBacking MaterialThickness of Backing (mm)Total Thickness (mm)Holding Power Min/inchAdhesion Strength kg/25mmAdhesive ComponentShield Efficacy 10MHz~ 1GHz (dB)Conductivity z-ohmsIntegrated thermal conductivity (W/mK)
XPH0M123Copper Foil0.0120.030±0.01≥1440>0.8Acrylic≥60<0.0360
XPH0M183Copper Foil0.0180.050±0.005≥1440>1.0Acrylic≥60<0.0360
XPH0M253Copper Foil0.0250.06±0.005≥1440>1.0Acrylic≥60<0.0380
XPH0M353Copper Foil0.0350.070±0.005≥1440>1.0Acrylic≥60<0.0390
XPH0M503Copper Foil0.0500.085±0.005≥1440>1.0Acrylic≥60<0.03110
XPH0M753Copper Foil0.0750.11±0.01≥1440>1.0Acrylic≥60<0.03130
XPH0MA03Copper Foil0.1000.135±0.01≥1440>1.0Acrylic≥60<0.03160
XPH0MA23Copper Foil0.1250.15±0.015≥1440>1.0Acrylic≥60<0.03170
XPH0MA53Copper Foil0.1500.20±0.02≥1440>1.0Acrylic≥60<0.03

190



Product Features
shielding ED copper foil
thickness 0.009--3mm, width 10-1380mm
easier to make a faraday cage, EMI room
generally 400-500kg/roll
Physical Properties
Density:8.9g/cm³
Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min
Thermal conductivity(20°C):390W/(m°C)
Elastic modulus:118000N/m
Softening temperature:≥380°C
Certification
meet the technical conditions GB/T 5187-2008 standards.

in accordance with ISO9001-2000 Quality system requirements



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