ABS Standard Waffle Pack Chip Trays High Temperature Resistance For Small Components

ABS Standard Waffle Pack Chip Trays High Temperature Resistance For Small Components

Need high-density storage for small dies? Our waffle packs are optimized for maximum chip capacity per tray.

When your product is not the shape of the specifications or height, we recommend that you customize a completely meet your component tray, reduce the spacing between the matrix and is convenient to pick up, in a tray design to maximize storage quantity, not only can safely place your components, also use more affordable data to complete the product design requirements.

A chip tray is a carrier for micro-components or wafer dies that are used to transport and transfer products. Therefore, the pocket size in all chip trays is designed according to the dimensions and specifications of specific components. Customization is the most suitable and perfect packaging solution.

HN 21014-2 Detail Information:

As for HN2014-2, usually used for loading small chips or components less than 10.5mm, the matrix quantity is 7*7=49PCS per tray, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories, such as cover, clip, and Tyvek paper of the existing series, and the complete package makes it easier to transfer, transport, and store the products.

Technical Parameters:

Advantages:

1. More than 12 years of export experience.

2. With professional engineers and efficient management.

3. Short delivery time and good quality.

4. Support small batch production in the first batch.

5. Professional sales within 24 hours efficient reply.

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service or cost performance being well recognized.

Application:

Wafer Die / Bar / Chips; PCBA module component; Electronic component packaging; Optical device packaging.

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/