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PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

Categories PCB Layout Design
Place of Origin: China
MOQ: Negotiable
Price: Negotiable
Payment Terms: T/T
Supply Ability: 100000pc/Month
Delivery Time: 4 Weeks
Packaging Details: PCB + Box
Brand Name: CUSTOM MADE
Certification: ISO/UL
Keyword: PCB Layout Design
PCB Board: Multi-Layer Boards, Rigid-Flex Boards
Applications: Consumer Electronics, Automotive Electronics, Communications, Internet
Surface Finished: HASL, HASL Pb Free Immersion Gold/Tin Osp,Immersion Gold+OSP
Materials: Nelco, PTFE, TU862, TU872, FR4
Features: Designability, Maintainability, Testability
Min Laser Hole: 0.075mm
Copper Thickness: 0.3-12 oz
Payment Method: T/T
Whether to Support customization: Support
Logistics: Accept customer specified logistics
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PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

PTFE PCB Layout Design Mixed Voltage Embedded Capacitor Carbon Ink


PCB Layout Design Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.


PCB Layout Design Parameters:

ItemTechnical Parameter
Layer2-64
Thickness0.5-17.5mm
Copper Thickness0.3-12 oz
Min Mechanical Hole0.1mm
Min Laser Hole0.075mm
HDI1+n+1,2+n+2,3+n+3
Max Aspect Ratio20:01
Max Board Size650mm*1130mm
Min Width/Space2.4/2.4mil
Min Outline Tolerance±0.1mm
Impedance Tolerance±5%
Min PP Thickness0.06mm
Bow &Twist≤0.5%
MaterialsFR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special CapabilityGold Finger Plating, Peelable, Carbon ink


PCB Layout Design Introduction:

1. Under normal circumstances, all components should be arranged on the same side of the circuit board. Only when the top components are too dense, can some devices with limited height and low heat generation, such as chip resistors, chip capacitors, Chip IC, etc. are placed on the bottom layer.

2. On the premise of ensuring electrical performance, components should be placed on the grid and arranged in parallel or perpendicular to each other to be neat and beautiful. In general, components are not allowed to overlap; the arrangement of components should be compact, and components should be placed on the entire layout. The distribution is uniform and the density is consistent.

3. The minimum spacing between adjacent pad patterns of different components on the circuit board should be more than 1MM.

4. The distance from the edge of the circuit board is generally not less than 2MM. The best shape of the circuit board is a rectangle, and the aspect ratio is 3:2 or 4:3. When the surface size of the circuit board is greater than 200MM by 150MM, it should be considered that the circuit board can withstand Mechanical strength.

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