Flip Chip CSP Package Substrate 5x5mm Green Color BT Material
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Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Single Crystal Monocrystal Semiconductor Substrate Indium Arsenide InAs Substrate
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... Substrate Indium Arsenide InAs wafer Application Indium Arsenide (InAs) single crystal semiconductor substrates are materials with unique properties, widely used in the electronics and optoelectronics fields. Here are some possible applications: 1....
SHANGHAI FAMOUS TRADE CO.,LTD
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4H-N 8inch Semiconductor Substrate SIC Silicon Carbide Wafer For Solar Photovoltaic
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...Semiconductor High Crystal Quality For Demanding Power Electronics, 4H-N 8inch TANKBLUE Brand Semiconductor Substrate SIC Silicon Carbide Wafer For Solar Photovoltaic Advantages of Silicon Carbide Hardness There are numerous advantages to using silicon carbide over more traditional silicon substrates. One of the ......
SHANGHAI FAMOUS TRADE CO.,LTD
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100KV Semiconductor Inspection Equipment CSP LED PCB X Ray Machine
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CSP LED X Ray Machine Closed Tube Flip Chip S7000 For 100KV Semiconductor Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ......
Shenzhen Wisdomshow Technology Co.,ltd
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Dielectric Constant 8-9 AIN Ceramic Substrate for Semiconductor Power Module
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... thermal conductivity Aluminum Nitride (AIN) ceramic, this substrate offers exceptional thermal management and electrical insulation properties, making it an ideal choice for a wide range of industrial applications. Surface Finish: ......
Wuxi Special Ceramic Electrical Co.,Ltd
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SC810 Semiconductor packaging parts deflux machine with CE approval
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Product Description SC810 is a compact in line spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 ......
Dongguan Shenhua Mechanical and Electrical Equipment ...
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EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection
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...Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP......
Unicomp Technology
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Semiconductor Strain Gauge Transducer SPD High Speed Bending Plate Scales
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Semiconductor Strain Gauge Transducer SPD High Speed Bending Plate Scales Semiconductor Strain Gauges SPD Semiconductor strain gauge (in the substrate) Send Inquiry SPECIFICATION Related Products Semiconductor strain gauge (in the substrate) F1 F2 F3 F4 F5 substrate: 8×4 silicon: D leg: 30 substrate: 7×4 silicon: B,C leg: 20~25 substrate: 8×3.5 silicon: B,C,D leg: 22 substrate: 8×2.5 silicon: B,C leg: 7.5~7.8 substrate......
Top Sensor Technology Co.Ltd
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Polyimide Flexible Pcb Circuit Board Substrate 0.45mm 4Layer
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0.45mm 4Layer flex main board with connectors WP27D-P050VA1 apply for VR helmet The combination of these two circuits makes it an extremely beneficial product for both applications as well as customers. Dynamism: Flexible circuits give you unlimited ......
Topmatch Electronics (Suzhou) Co., Limited.
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4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device
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... and carbon with chemical formula SiC. SiC is used in semiconductor electronics devices that operate at high temperatures or high voltages, or both.SiC is also one of the important LED components, it is a popular substrate for growing GaN devices, and it...
Shenzhen A.N.G Technology Co., Ltd
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