Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS
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Shenzhen Hiner Technology Co.,LTD
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BGA type packaging memory substrate manufacture
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...Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality guarantee,It is also one of types of the semiconductor package substrate,for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip
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...Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA......
ShenZhen Mingjiada Electronics Co.,Ltd.
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
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...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......
Shenzhen Sai Collie Technology Co., Ltd.
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AMD ATI Radeon 216-0731004 GPU new Computer IC Chips BGA GPU chips video
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...Chips BGA GPU chips video 216-0731004 is a GPU chip. Place of Origin: TAIWAN Brand Name: ATI Model Number: 216-0731004 Type: Drive IC Application: MP3/MP4 Player Supply Voltage: 3V Dissipation Power: W Operating Temperature: C package: FCBGA WE also have others BGA......
Mega Source Elec.Limited
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High Purity 99.7% Al2o3 Ceramic Substrate For LED Packages Chip Resistors
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Product Description High Purity 99.7% Al2o3 Ceramic Substrate For LED Packages,Chip Resistors Alumina Ceramic: Alumina ceramics are classified into high-purity type and ordinary type. The high-purity alumina ceramics have a Al2O3 content of 99.9% or mor......
Wuxi Special Ceramic Electrical Co.,Ltd
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MPC8548VJAVHD Electronic IC Components BGA Package Customization Service
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... a current range of 1A, 2A and 3A, size options of 0.4mm, 0.5mm and 0.65mm, package/case options of QFP, BGA, TSSOP38, HTSSOP38 and TSOP48, power options of 1W, 2W and 3W, and voltage options of 3.3V, 5V and 12V. Our Electronic IC Chips can be used for...
STJK(HK) ELECTRONICS CO.,LIMITED
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GM8312SF-BA Integrated Circuit BGA IC Chip
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GM8312SF-BA Integrated Circuit BGA IC Chip List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND SW-438TR-3000 M/ACOM PRIXP422ABB ......
Shenzhen Koben Electronics Co., Ltd.
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ......
QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
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200MHz Bga Ic Chips 594 Kbit EP4CE30F23C8N EP4CE30F23I7N FPGA
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...BGA-484 New and origianl parts IC chips In Stock EP4CE30F23C8N EP4CE30F23C6N EP4CE30F23I7N Mfr. #: EP4CE30F23I7N Specification: Description FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 1803 LABs 328 IOs Product Cyclone IV E Embedded Memory 594 kbit Number of I/Os 328 I/O Operating Supply Voltage 1.2V Minimum Operating Temperature - 40 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
ChongMing Group (HK) Int'l Co., Ltd
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