2.4 Gbps Ethernet Chip BCM4398D0XKWBG BGA Package WiFi 6E Smartphone Chip
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...Chip BCM4398D0XKWBG BGA Package WiFi 6E Smartphone Chip Product Description Of BCM4398D0XKWBG BCM4398D0XKWBG is 2.4 Gbps Ethernet Chip - WiFi 6E Smartphone Chip, achieved a maximum throughput of 2.01 Gbps. Specification Of BCM4398D0XKWBG Part Number: BCM4398D0XKWBG Network Speed: 2.4 Gbps channel indication: 6 GHz Latency Improvement: Up To 2x Latency Improvement Lower Power Consumption: 5x Lower Power Consumption Package: BGA...
ShenZhen Mingjiada Electronics Co.,Ltd.
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Original integrated circuit IC BGA Package electronic components CHIP RK3126
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ShenZhen QingFengYuan Technology Co.,Ltd.
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AR9344-DC3A BGA Electronic IC Chip Wifi IC Chip Atheros SMD Mounting Type
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AR9344-DC3A BGA integrated circuit Wifi IC Chip Atheros List Of Other Electronic Components In Stock PART NUMBER MFG/BRAND PART NUMBER MFG/BRAND XC6219F122PR-G TOREX TMS320DVC5416GGU TI ......
Shenzhen Koben Electronics Co., Ltd.
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
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...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......
Shenzhen Sai Collie Technology Co., Ltd.
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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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BCM56567B0KFSBG Programmable IC Chip Ethernet Switch IC BGA Package
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... in a wide range of applications. It features high-performance gate array IC design, programming cycles from 100 to 10000, and a variety of packages including QFP, BGA, and more. This chip is capable of...
STJK(HK) ELECTRONICS CO.,LIMITED
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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package
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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit Speed ......
Mega Source Elec.Limited
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Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS
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Shenzhen Hiner Technology Co.,LTD
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XC7A200T-3SBG484E BGA Components Integrated Circuit Chip IC
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XC7A200T-3SBG484E BGA Components New Original Tested Integrated Circuit Chip IC XC7A200T-3SBG484E To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach ......
HK LIANYIXIN INDUSTRIAL CO., LIMITED
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ......
QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
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