75w 1064nm Picosecond Ir Laser Brittle Material Processing
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... counts 4 Applications: Brittle material processing Parameters Unit Topaz-1064-75 Minimum Typical Maximum Optical Data CW-Output Power W 75 - - Center ......
BWT Beijing Ltd.
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50W Picosecond Infrared Laser 1000uJ Maximum Burst Energy For Precision Processing
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Infrared Picosecond Laser(50W) is used in precision processing applications such as silicate glass cutting, high-borosilicate glass tube cutting, high-transmission brittle material engraving, and metal microporation, etc. The unique zoned modular unit ......
GZ Photonics Technology Co. , Ltd
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130W Picosecond Fiber Laser Single Mode Picosecond Pulsed Laser Diode
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...picosecond green fiber laser Product introduction of picosecond green fiber laser Our VP has PhD degree. Gongda laser is a new industrial picosecond green fiber laser with stable and reliable characteristics, which ensures economy while supporting high-precision processing. The laser adopts optical and electrical integrated design. This series of products can be widely used in material micro processing......
Shenzhen Gongda Laser Co., Ltd.
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Multi Mode 375~1550nm Laser Diode FAC Optional For Laser Module
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.... Laser marking is a marking method that uses high-energy-density lasers to locally irradiate the workpiece to vaporize or change the color of the surface material, thereby leaving a permanent mark. Laser marking can produce a variety of characters,...
XINLAND LASER CO.,LTD
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Microfluidic Laser Equipment Technology Used To Process The Hard And Brittle Materials Of Cermet Silicon Carbide
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Product Introduction The microjet laser device is a revolutionary precision machining system that achieves thermal damage-free, high-precision material processing by coupling high-energy laser beams to micron-scale liquid jets. The technology is ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Infrared Picosecond Glass Laser Cutting Machine Environmental Protection With 10ps Pulse Width
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Product Description: This thick glass laser cutting machine has a laser power of 30/50/60/75/80/90w, giving it the capability to cut through thick and tough glass materials with ease. It is perfect for cutting stained glass and other decorative glass ......
ShenZhen CKD Precision Mechanical & Electrical Co., Ltd.
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Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz / Optical Glass Processing
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...Picosecond Dual-Platform Laser Cutting System for Sapphire/Quartz/Optical Glass Processing The infrared picosecond dual-platform glass laser cutting system is a high-end precision machining solution based on ultrafast laser technology. It utilizes a 1064nm infrared picosecond laser (pulse width 1-10ps) combined with a dual-station platform design, specifically engineered for precision processing of high-hardness brittle...
SHANGHAI FAMOUS TRADE CO.,LTD
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30w 60w 80w Picosecond Ultra Fast Laser Glass Cutting and Splitting Machine for Positioning accuracy
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...Picosecond Ultra Fast Laser Glass Cutting and Splitting Machine (Model: PEG-100) >>>>> Machine Introduction The laser glass cutting and splitting machine uses an ultra-fast infrared picosecond laser and a Bessel cutting head to achieve high-quality, high-efficiency, taper-free, um-level edge-breaking cutting of hard and brittle glass materials. It’s also equipped with a stable laser......
Perfect Laser (Wuhan) Co.,Ltd.
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CE Laser Marking Machine , 12000mm/S Metal Fiber Laser Marker
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...laser marking machine price /fiber laser engraver/laser marker on metal 1. can be a variety of metal, non-metallic materials tor processing.Especially tor high hardness, high melting point, brittle material marking more obvious advantages. 2. belongs to the non-contact processing, does not damage the product, no tool wear,marking good quality. 3. The laser beam is fine, the processing material......
Wuhan Bochuangxing Laser Technology Co., Ltd.
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Gold Silver Marking Movable 20 Watt Fiber Laser Engraver
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...Laser Engraver RL-20P Small Fiber Laser Engraving Machine Highlight: compact size, small and portable. Advantages 1. It can process various metals. Especially for high hardness, high melting point and brittle materials, marking has obvious advantages. 2. Non-contact processing, no product damage, no tool wear. 3. The laser beam is thin, the processing material consumption is small, the processing......
Riselaser Technology Co., Ltd
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