IC Substrate PCB Multilayer Rigid Printed Circuit Board LGA Package ENIG Finish
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Black Solder Mask IC Substrate PCB 0.2mm RoHS Compliant For Electronic Devices BT materials SD card
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2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}......
LT CIRCUIT CO.,LTD.
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Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD
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3oz Copper ENIG finished double sided PCB Printed circuit board
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...ENIG finished double sided PCB Printed circuit board 1. Product Description Item Specification PCB type Rigid PCB, FPC, Rigid-Flex PCB Min panel size 50*50mm Max Panel size 450*450mm Surface control Lead, Lead free, Kapton Tape,DIP,Automatic coating of three defenses BGA pitch 0.35mm PCB......
Shenzhen Fany Technology Co.,Ltd
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1OZ 1.0mm Aluminum PCB Board OSP Finished Aluminium Substrate Pcb
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... covers a total production area of 10,000 square meters, employs more than 350 workers, produces over 5,000 PCB types monthly. Its products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products,...
Huashengxin Circuit Limited
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0.2mm To 3mm Thick ENIG Finish SMD Multilayer PCB For Industrial Controller
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enig finish smd multilayer pcb for industrial controller high end Item(SMT) Process Capability Largest card board L50×W50mm～L510×W460mm Maximum thickness 3mm Minimum thickness 0.2mm Smallest chip part 150mm*150mm,01005 Encapsulation or above Maximum part ......
Guangzhou Highleap Electronic Co.,Ltd.
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IPC-A-610F Class II ENIG finish Heavy Copper Pcb For Solar Power
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2 layers PCB made of FR4,Aluminum immersion gold heavy copper for solar power UL 94V0 One of the PCB assembly magnate, IBE adopts advanced production techniques and manufacturing practices with specialization in a varied range of PCB fabrication process, ......
IBE ELectronics Co.,LTD
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Custom IC Substrate PCB , Printed Circuit Board Assembly 0.15mm Plate Thickness 2 layers of COF PI reinforcement, minimu
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2 layers of COF Panasonic material PIGL042504-250MH, CU9/1um,plate thickness,IC Package Substrate 2 layers of COF PI reinforcement, minimum hole 0.05mm, Product Description Product area: industrial liquid crystal driver Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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HASL OSP ENIG Finishing FR4 Prototype PCB Board
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Prototype Pcb Manufacturing Printed Circuit Board Layout Service We can manufacture Rigid PCB, Flexible, Rigid-flex, HDI board, High TG PCB; Manufacture PCB board up to 32 layer, Raw material: Fr4, Rogers, Arlon, Teflon, Taconic, Nelco, Isola, Ceramic, ......
Shenzhen Changkeshun Technology Co., Ltd.
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FR4 core memory ic substrate manufacture
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...IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package Sd card / memory card Spec.of pcb production: Mini.Line space/width 35/35um - 20/20um - 10/10um Finished......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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