Low Melting Point Thermal Interface Material Phase Changing Materials for Notebook Desktop
|
Low Melting Point Thermal Interface Material Phase Changing Materials for Notebook Desktop Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Low-Melting Thermal Interface Material Phase Change Materials Thermal Pad For Electric Motor Control Equipment
|
...material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide ......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result......
Adcol Electronics (Guangzhou) Co., Ltd.
|
TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
|
... conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
|
High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and ......
Trumony Aluminum Limited
|
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
|
Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has ......
ZSUN CHIPS CO., LTD
|
Interlining And Interfacing , High Stretch Interlining Cloth / Interfacing Material
|
Interlining and interfacing , High stretch interlining cloth / interfacing material Detailed Description: TECHNICAL SPECIFICATION SHEET P5020 Composition 100% Polyester Yarn Count 50D * 50D Mesh 24 Color White , Optical White , Black Width 122cm , 150cm ......
Shanghai Uneed Textile Co.,Ltd
|
ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
|
ShinEtsu X-23-8117 Thermal Interface Material - High Conductivity Screen Printing Grease for Semiconductors Basic Product Attributes ShinEtsu X-23-8117 is a gray high-performance thermal interface material with a pre-flash viscosity of 80 Pa·s, post-flash ......
Shenzhen Huazhisheng New Material Technology Co., Ltd.
|
5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
|
5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
|
High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
|
...unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic composites, and electronic packaging applications. Technical Specifications Available Particle Size...
Shaanxi KeGu New Material Technology Co., Ltd
|