Customized Metal 6 8 12 Inch Semi Wafer Dicing Frame Ring Metal Ring Wafer Frame
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... processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use. Semi-Wafer Cutting Frame Ring (1)This wafer dicing frame is...
Shenzhen Hiner Technology Co.,LTD
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Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing
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Abstract of microjet laser technology equipment Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging
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... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of...
Shenzhen KHJ Technology Co., Ltd
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For 25PCS 12 Inch Wafer Flex Frame Shipper Conductive PP Black Wafer Storage Box
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...Wafer Flex Frame Shipper Conductive PP Black Wafer Storage Box Buffer seismic structure The internal design has cushioning materials to reduce vibration and impact during transportation, ensuring the safety of the wafer. Superior protective performance Using high-strength materials such as polypropylene or polycarbonate effectively prevents wafer......
Shenzhen Hiner Technology Co.,LTD.
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Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade
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0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility......
Shaanxi Tongyu Industry And Trade Co,.Ltd
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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting
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Automated Precision Dicing Machine High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics......
SHANGHAI FAMOUS TRADE CO.,LTD
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Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade
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Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and ......
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Plastic Wafer Dicing Potato Wedges Cutting Machine Made In China
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Certifications Product Description The vegetable cutting machine can accurately cut "slices, silk, strips" and work efficiently. The speed of the conveyor belt and the speed of the turning knife are adjusted by the frequency converter, and can be ......
Henan Huafood Machinery Technology Co.,Ltd.
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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
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... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system...
YUSH Electronic Technology Co.,Ltd
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Purple resin&snowflake metal frame tabletop role-playing game specific multi sided dice set
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..., faces, and various polyhedral shapes. The interactive 3D shapes make for an engaging learning experience. Every artisan set is hand-poured, so the dice may have slight differences in color and material suspension. Please...
Yuzhi Group Co.,Ltd
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