multiple wafers nand csp substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm...

Brand Name:ZMSH

Model Number:customized

Place of Origin:China

... of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer available for Customization and In-house Inspection BonTek, as a custom glass manufacturer, can provide a price whether your requirement is for a glass sheet of multiple sizes or a single sheet of glass of Soda Lime glass, Fused Silica, Borofloat 33, or other glass substrates...

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

...Wafer We provides MBE / MOCVD epitaxial growth of custom structure on GaAs substrate for microelectronics , optoelectronics and RF Microwave applications , in diameter Ø 3" to Ø 4” . With our extensive MOCVD experience , we can grow binary alloy ( LT-GaAs , AlAs ) or ternary alloy ( AlGaAs , InGaAs ,GaAsP , InGaP ) on GaAs substrate , singel layer or multiple...

Brand Name:Winbond Electronics

Model Number:W25N01GWTBIT

Place of Origin:Multi-origin

...85°C - Flash memory type: NAND - Interface: SPI, QPI - Data retention: 10 years - Endurance: 100,000 program/erase cycles - Packaging: Wafer/Chip Scale Package (WSP/CSP) Applications: - Embedded systems - Automotive systems - Industrial systems - Mobile...