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Blue Solder Mask Silkscreen Circuit Board OSP PCB Surface Finish 1.0 MM Thickness

Categories 6 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB0033
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
No of layers:: 6 Layer
Material:: FR4 TG>130
PCB Thickness: 1.2 MM
Solder mask colour:: Blue Solder Mask
Surface technics:: OSP
Min Hole Diameter: 0.2 MM
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Blue Solder Mask Silkscreen Circuit Board OSP PCB Surface Finish 1.0 MM Thickness

6 Layer PCB OSP Treatment Blue Solder Mask 1.0 MM Thickness


Printed Circuit Board Features:


1 6 Layer printed circuit board used in earphone

2 FR4 substrate material, tg 150 degree.

3 Black solder mask and white silkscreen.

4 ENIG, gold thickness 2U'

5 Finished pcb thickness 1.0mm.

6 35 um copper thcikness on each layer.

7 PCB file or gerber file should be offered by customer.

8 Customized printed circuit board.

9 Epoxy filled in vias.


Our history:



IT180A Data Sheet:


IT-180ATC
High Tg / Lead Free / High Reliability Laminate & Prepreg
 Excellent CAF resistance
 Good through-hole reliability
 Low CTE and high thermal reliability
 For automotive, high layer PCB, networking, and heavy copper applications
Laminate properties
ItemsIPC TM-650Typical ValueUnit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.85
8
lb/inch
Volume Resistivity2.5.17.11x109M-cm
Surface Resistivity2.5.17.11x108M
Moisture Absorption, maximum2.6.2.10.10%
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1Pass PassRating
FlammabilityUL94V-0Rating
Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
Glass Transition Temperature(DSC)2.4.25175˚C
Decomposition Temperature2.4.24.6345˚C
X/Y Axis CTE (40℃ to 125℃)2.4.4111-13 / 13-15ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.2445
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1>60
20
Minutes Minutes

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